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LEAD FRAME PLATING 表面處理設備 LED電鍍 PCB電鍍
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...  [IC leadframe surface treatment equipment]

   
WATER JET DEFLASH SYSTEM

滾鍍設備

Best choice for Deflash

Specification:

  1. Process:
    Feeding → Front water jet
    →Back water jet → absorbent cotton to water
    → air knife remove water→ auto unload
  2. Production rate: 2 ~ 9 Meter/min
  3. Applicable product size:
    Length 300mm ; Width 90mm
    Thickness below 5mm.
  4. Water jet pressure : Maximum 340BAR.

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PCB電鍍 表面處理設備
   
吊鍍設備
 
   
IC Lead Frame continuous automatic surface treatment SYS

LED電鍍

MAXGOOD Functional Electronic Coating System
Model: MAX-FECS-002

Specification:

  1. IC lead-frame continuous automatic precision surface treatment:

    Full-featured integrated IC removal encapsulated epoxy resin, the IC surface etching, chemical anti-oxidation coating, composite IC heat sink surface treatment, chemical, metal coating, pin (points) metal coating, and the pin (point) and anti-oxidation layer processing

  2. Applicable products:

     Precision IC package BEOL LED packaging BEOL, after the cooling type IC package process; The machine can be quickly converted to the IC lead  frame surface treatment process.

  3. Applicable size : 250mm X 100mm

  4. Features :

    Eco-friendly, energy, water on-saving 50% high efficiency, PLC Human Machine Interface auto-control system

  5. Manufacturing Technology:
    上料機構台灣新型專利証號210864
    中國大陸實用新型專利証號581086

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